Importance

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Abstract

An exposure apparatus has an illumination optical system 37 an exposure machine main portion (29). The illumination optical system (37) includes, for example, a cooling fan (43) and mounted on an independent column (36) which is fixedly mounted on a floor (1). The exposure machine main portion (29) includes a reticle stage (27), a projection optical system (25), a wafer stage (20), first and second support columns (24 and 26) and a platen (6). The exposure machine main portion (29) is mounted on the floor (1) through height adjustors (3A-3D) and the associated vibration isolators (4A-4D) and capable of six-degree-of-freedom displacement by means of actuators (7A, 7B and 32A-32C). Capacitor type sensors (44A and 44B) are provided between the independent column (36) and the second column (26) for detecting any misalignment and the distance between the illumination optical system (37) and the exposure machine main portion (29). The relative position of the illumination optical system (37) and the exposure machine main portion (29) is controlled by a controller (11) based on the misalignment and the distance detected. In this manner, any vibrations and shakings of the illumination optical system as produced by the cooling fan for removing the heat generated in the exposure light source is transferred only to the independent column (36) and not to the exposure machine main portion (29), resulting in an enhanced alignment accuracy between the mask (reticle) and the photosensitized substrate (wafer).

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First Claim