Integral solder and plated sealing cover and method of making the same
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United States of America Patent
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May 21, 2002
Issued Date -
N/A
app pub date -
Jan 6, 1999
filing date -
Jan 6, 1998
priority date (Note) -
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Abstract
A method of making an integral plated and solder clad cover lid for electronic packages is disclosed. The cover lid is plated and or clad with a first corrosion resistant and solderable material and is clad with a solder material on one side. The cladded substrate is stamped and then plated with a second corrosion resistant and solderable material. The second material is subsequently sintered and preferentially diffused into the solder material resulting in a visual distinction between the solder side of the cover lid and the backing side.
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