Thick film low value high frequency inductor, and method of making the same
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United States of America Patent
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May 21, 2002
Issued Date -
N/A
app pub date -
Nov 27, 2000
filing date -
Sep 17, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thick film low value high frequency inductor made by the process of subjecting a conductor layer to a plurality of linear cuts by a pulsing laser cutter imposed simultaneously on the entire length of the linear cut being made to create a cross sectional cut of substantial rectangular configuration. The conductor body is a layer of dried silver thick film ink. The method of making a thick film low value high frequency inductor involves the steps of taking a conductor layer comprised of a dried layer of photo sensitive silver ink, masking the ink with the negative of the desired configuration of the ink, exposing the ink to UV radiation, developing the ink, and firing the layer to adhere the silver to the layer.
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