Method for controlling solderability of a conductor and conductor formed thereby
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United States of America Patent
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May 21, 2002
Grant Date -
N/A
app pub date -
Jun 28, 1999
filing date -
Jun 28, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thick-film conductor, a method for forming the conductor, and a method for attaching a surface-mount circuit device to the conductor with a solder connection. The conductor is formed of a thick-film conductive ink that would normally produce a solderable conductor, but is rendered unsolderable by additions of a fine inorganic particulate material. A solderable region, preferably a pillar, is then selectively formed on the unsolderable conductor to determine the distribution and height of the solder connection on the conductor. In order to suitably affect the solderability of the conductor, the particulate material is present as a fine dispersion and in a sufficient quantity, but not in quantities that significantly affect the electrical, mechanical and processing characteristics of the conductor.
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