Semiconductor chip assembly with anisotropic conductive adhesive connections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 21, 2002
Grant Date -
N/A
app pub date -
Jul 24, 1998
filing date -
Sep 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly including a semiconductor chip having contacts on a front surface, an element having terminals thereon and leads connecting the contacts to the terminals, wherein the leads are connected to the chip contacts by Z-conductive adhesive connections. In a preferred embodiment, the Z-conducting adhesive is present as a thin layer having appreciable electrical conductivity only in a direction through the layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully