Semiconductor device including solid state imaging device
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United States of America Patent
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May 21, 2002
Grant Date -
N/A
app pub date -
Aug 13, 1996
filing date -
Aug 25, 1995
priority date (Note) -
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Importance
Abstract
A semiconductor device such as a solid state imaging device has a semiconductor chip mounted on a bottom surface of a cavity of a hermetic sealed box-shaped resin-molded package. The device comprises a radiator plate provided in a bottom wall of the package under the cavity or on the bottom surface of the cavity. The semiconductor chip and the radiator plate are bonded with an adhesive having a larger thermal conductivity than that of the resin forming the package. The radiator plate may be a part of a lead frame.
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