Flexibly suspended heat exchange head for a DUT
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United States of America Patent
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May 21, 2002
Grant Date -
N/A
app pub date -
Jun 22, 1998
filing date -
Oct 23, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermoconductive module to control the temperature of a DUT including a top surface having an area and a topography comprising, in combination, a heat exchange surface for interfacing and engaging with the top surface of the DUT, a plurality of individually moveable elements arranged throughout the area of the top surface of the DUT for moving the heat exchange surface to contour the heat exchange surface to map the topography of the top surface of the DUT and means in thermal communication with the heat exchange surface for producing the heat transfer between the top surface of the DUT and the heat exchange surface.
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