Low contamination high density plasma etch chambers and methods for making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 28, 2002
Issued Date -
N/A
app pub date -
Jan 19, 2000
filing date -
Mar 31, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A plasma processing chamber having a chamber liner and a liner support, the liner support including a flexible wall configured to surround an external surface of the chamber liner, the flexible wall being spaced apart from the wall of the chamber liner. The apparatus can include a heater thermally connected to the liner support so as to thermally conduct heat from the liner support to the chamber liner. The liner support can be made from flexible aluminum material and the chamber liner comprises a ceramic material. The flexible wall can include slots which divide the liner support into a plurality of fingers which enable the flexible wall to absorb thermal stresses.
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