Electrical interconnection for wide-array inkjet printhead assembly
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United States of America Patent
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-
May 28, 2002
Grant Date -
N/A
app pub date -
Mar 20, 2001
filing date -
Mar 20, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wide-array inkjet printhead assembly includes a carrier including a substructure and a substrate mounted on the substructure, a plurality of printhead dies each mounted on the substrate, and an electrical interconnect adapted to communicate electrical signals between an electronic controller and the inkjet printhead assembly. The substrate has an electrical circuit formed therein such that the printhead dies are electrically coupled to the electrical circuit and the electrical interconnect is electrically coupled to the electrical circuit. As such, the substructure accommodates the electrical interconnect.
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