Method for housing sensors in a package
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United States of America Patent
Stats
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May 28, 2002
Grant Date -
Sep 20, 2001
app pub date -
Mar 13, 2001
filing date -
Mar 14, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires. In a second method step, the package is formed by molding, in particular injection molding. In a third method step, or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.
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