Printed circuit board and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 28, 2002
Grant Date -
N/A
app pub date -
Nov 13, 2000
filing date -
Nov 16, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board includes a rectangular, insulating substrate and a conductive land formed on the substrate. The land is arranged near a selected one of the longitudinal edges of the substrate. An L-shaped terminal is mounted on the substrate, so that its longer horizontal portion overlaps the land, while its shorter bent portion is engaged with a positioning groove formed in the selected longitudinal edge of the substrate. The land is caused to protrude from the overlapping horizontal portion of the terminal toward the opposite longitudinal edge of the substrate.
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