Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station
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United States of America Patent
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May 28, 2002
Grant Date -
N/A
app pub date -
May 15, 2000
filing date -
May 15, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package test station supports an integrated circuit package under test in a vertical orientation thereby allowing simultaneous access to both sides of the package. Probe assemblies are utilized on both sides of the package to increase the accuracy, efficiency, and simplicity of performing electrical characterization of the IC package. The IC package holder as well as the probe assemblies are adjustably positioned to allow accurate and precise measurements of through-package electrical characteristics. To aid in positioning the test equipment, a dual-display image magnification system is used which provides images from both sides of the IC package simultaneously.
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