Self-heating circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 28, 2002
Grant Date -
N/A
app pub date -
Jul 30, 1999
filing date -
Jul 30, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Separate heating elements are embedded in a printed circuit board near integrated circuit (IC) packages or other parts mounted on the circuit board. Each heating element supplies heat to the part residing near it in response to an input voltage pulse. The heating elements are used to selectively melt solder or adhesives attaching the parts to the circuit board so that they can be easily removed or to temporarily melt solder or cure adhesive when the parts are mounted on the circuit board. The heating elements are also used to supply heat to IC packages for regulating their operating temperatures.
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