Importance

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Abstract

A process for treating aqueous waste comprising a copper plating waste stream, a copper rinse stream containing organic carbon and solid particles, and a copper chemical mechanical planarization stream (CMP) containing solid particles is provided. This process includes electrowinning the copper plating waste stream to remove copper and create a blow down stream, filtering the rinse stream to remove solid particles, adding the blow down stream to the CMP stream, treating the blow down stream and the CMP stream with a flocculant or coagulant to form larger solid particles, removing the larger solid particles from the CMP stream and separating the resulting stream into a liquid containing copper, a concentrated regenerant, and a dilute regenerant, adding the concentrated regenerant to the waste stream before the electrowinning step, adding the dilute regenerant to the rinse stream before filtering to remove solid particles, and adding the liquid containing copper to the CMP stream during the treating step. The present invention further includes a system for treating aqueous waste that follows the above-described process.

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First Claim