Integrated circuit socket assembly having integral shielding members
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United States of America Patent
Stats
-
Jun 4, 2002
Grant Date -
N/A
app pub date -
Aug 30, 2001
filing date -
Aug 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.
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