Heat and cooling treatment apparatus and substrate processing system

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United States of America Patent

PATENT NO 6402508
APP PUB NO 20010013515A1
SERIAL NO

09729714

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is an apparatus for performing heat and cooling treatments for a substrate includes: a heating table for mounting the substrate thereon to perform the heat treatment for the substrate; a cooling table for mounting the substrate thereon to perform the cooling treatment for the substrate; a waiting table for allowing the substrate to wait; a carrying mechanism for carrying the substrate between the heating table, the cooling table, and the waiting table; and airflow formation means for forming airflow in a space in which the heating table, the cooling table, and the waiting table are arranged.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Koji Kumamoto, JP 103 847
Ueda, Issei Kumamoto, JP 52 2498

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