Microelectronic contact assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 11, 2002
Grant Date -
N/A
app pub date -
Nov 3, 2000
filing date -
Nov 3, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic interconnect includes a flexible circuit which has a plurality of contacts formed thereon. A plurality of springs is positioned so as to apply a compressive force to at least one of the contacts when the electronic interconnect is mated. A resilient material is configured to apply a compressive force to at least one of the springs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully