Slurry recirculation system for reduced slurry drying
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United States of America Patent
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Jun 11, 2002
Grant Date -
N/A
app pub date -
May 3, 2000
filing date -
May 3, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The present invention provides a slurry delivery system comprising a slurry conduit couplable to a wall of the slurry tank, and configured to receive a slurry therein and deliver a stream of the slurry against an inner wall of the slurry tank. Thus, the system inhibits drying of a slurry within the slurry tank and minimizes agglomeration on the sides of the slurry tank that results from slurry drying on the sides of the slurry tank's wall when the slurry level within the tank rises and falls. This minimization of agglomeration reduces the agglomerates within the slurry supply, which in turn, reduces the number of contaminants and scratches affecting the overall quality of the semiconductor wafer substrate.
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