Glue application device with glue conduit surrounding hardener conduit
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United States of America Patent
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Jun 11, 2002
Issued Date -
N/A
app pub date -
Sep 28, 1999
filing date -
Feb 21, 1997
priority date (Note) -
Expired
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Abstract
A method for supplying a multicomponent fluid thermosetting resin gluing system in which a first fluid component is brought to flow in a first stream, and a second fluid component is brought to flow in a second stream, wherein the second stream is brought to encircle the first stream. A device for carrying out the method comprising a first body (10) provided with outlet conduits (20,21,22); a second body (30) having as many outlet apertures (40,41,42) as there are outlet conduits of the first body; each conduit being introduced into one aperture. Use of the device for which the apertures in the second body shell are fitted with externally protruding outlet conduits having an outlet nozzle, each conduit introduced into the same aperture extending beyond the nozzle of the conduit fitted to the same aperture, for supplying a multicomponent fluid thermosetting resin gluing system according to the method.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- AKZO NOBEL N.V.
International Classification(s)
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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Andersson, Sven-Erik | Nacka, SE | 7 | 46 |
Vesterlund, Lennart | Hagersten, SE | 4 | 7 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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