Apparatus and method for a reliable return current path for sputtering processes
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United States of America Patent
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Jun 11, 2002
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N/A
app pub date -
Feb 13, 1995
filing date -
Feb 13, 1995
priority date (Note) -
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Abstract
A method for establishing and maintaining a reliable ground for reactive sputtering systems. A spatially extended high density plasma is generated in a large region surrounding the sputtering target. The plasma electrically connects the target to a part of the coating machine that is not subject to deposition of sputtered material from the target. The plasma is generated by an applicator which is independent of the target.
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