Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
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United States of America Patent
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Jun 11, 2002
Grant Date -
N/A
app pub date -
May 17, 1996
filing date -
May 17, 1996
priority date (Note) -
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Abstract
The present invention relates to electronic assemblies which include an elastomeric member made of a cured, room-temperature curable polysiloxane composition. When the assemblies are used to electrically interconnect a first contacting site on a first electronic device to a second contacting site on a second electronic device, the stress-relaxation resistant properties of the elastomer enhance local contact force to maintain a reliable connection.
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