Method of making a semiconductor chip assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 11, 2002
Issued Date -
N/A
app pub date -
Jun 11, 2001
filing date -
Aug 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, and providing a support circuit that includes an insulative base and a conductive trace. One embodiment includes mechanically attaching the chip to the support circuit using an adhesive such that a portion of the pad is directly beneath the conductive trace, and then applying an etch to form openings in the base and the adhesive such that the opening in the base exposes the conductive trace and the openings expose the pad. Another embodiment includes disposing an adhesive beneath the support circuit, applying an etch to form openings in the base and the adhesive, and then mechanically attaching the chip to the support circuit using the adhesive such that the opening in the base exposes the conductive trace and the openings expose the pad. Preferably, a connection joint is formed inside the openings that contacts and electrically connects the conductive trace and the pad.
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