Planarization of non-planar surfaces in device fabrication
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United States of America Patent
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Jun 11, 2002
Issued Date -
N/A
app pub date -
Feb 21, 2001
filing date -
Oct 22, 1998
priority date (Note) -
Expired
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Abstract
A method of planarizing a surface of a wafer includes providing a planarization material on the wafer surface and bringing a substantially flat surface into contact with the planarization material on the wafer. The planarization material is exposed to radiation at a first wavelength to cure the planarization material and is exposed to radiation at a second wavelength to cause changes to the planarization material that facilitate separation of the substantially flat surface from the planarization material.
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