Modified polyamide resin and heat-resistant composition containing the same
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United States of America Patent
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Jun 11, 2002
Grant Date -
N/A
app pub date -
Jan 7, 2000
filing date -
May 7, 1998
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Expired
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Abstract
A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.
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