Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
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United States of America Patent
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Jun 18, 2002
Grant Date -
N/A
app pub date -
Jun 25, 1999
filing date -
Jun 25, 1999
priority date (Note) -
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Abstract
A method and system are provided for cleaning a surface of a semiconductor wafer following a fabrication operation. The system includes a brush box, which has a fluid manifold and at least one nozzle. The nozzle is connected to the fluid manifold by a flexible conduit. The nozzle is configured to spray a liquid onto the surface of the wafer at an application angle and at a fan angle. The application angle is defined between a plane of the surface of the wafer and a spraying plane of the liquid. The fan angle and the application angle are configured such that the spraying liquid covers the surface of the wafer in a quiescent manner.
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