Hermetically-sealed sensor with a movable microstructure
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United States of America Patent
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Jun 18, 2002
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N/A
app pub date -
Jun 19, 1998
filing date -
Jun 19, 1997
priority date (Note) -
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Abstract
A sensor with a movable microstructure including a sensitive element, formed in a first chip of semiconductor material for producing an electrical signal dependent on a movement of at least one movable microstructure relative to a surface of the first chip. The sensitive element is enclosed in a hollow hermetic structure, and circuitry for processing the electrical signal is formed in a second chip of semiconductor material. The hollow hermetic structure includes a metal wall disposed on the surface of the first chip around the sensitive element, and the second chip is fixed to the metal wall.
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