Unsupported chemical mechanical polishing belt
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United States of America Patent
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Jun 18, 2002
Grant Date -
N/A
app pub date -
Aug 31, 1999
filing date -
Aug 31, 1999
priority date (Note) -
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Abstract
A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
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