I/C chip assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 18, 2002
Grant Date -
May 30, 2002
app pub date -
Nov 30, 2000
filing date -
Nov 30, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A chip mounting assembly includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted on the substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed on the substrate. The stiffener has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad.
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