Printed circuit board capable of preventing electrical short during soldering process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 18, 2002
Grant Date -
N/A
app pub date -
Mar 10, 2000
filing date -
Mar 13, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board containing pin-through holes includes components for mounting on the printed circuit board to be electrically connected with the printed circuit board, wherein each of the components includes a plurality of pins for inserting into the pin-through holes, patterns formed on the printed circuit board, wherein the patterns are located adjacent to a last one hole among the arranged pin-through holes, and at least one zone formed on at least one of the patterns, wherein a surface of the at least one zone is capable of being soldered, and wherein the at least one zone is formed on the same line passing through the plurality of pins and to absorb an excess amount of the solder at the last one hole, which prevents an electrical short due to the excess solidification of the solder at the last solder.
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