US Patent No: 6,407,929

Number of patents in Portfolio can not be more than 2000

Electronic package having embedded capacitors and method of fabrication therefor

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

An electronic package (302, FIG. 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. 17-18) or ceramic capacitors. During the package build-up process, the capacitors are mounted (410, FIG. 4) to a package layer, and a non-conductive layer is applied (412) over the capacitors. When the build-up process is completed, the capacitor's terminals (604, 608, FIG. 6) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (1904, FIG. 19), an interposer (1906), and/or a printed circuit board (1908).

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEL CORPORATIONSANTA CLARA, CA24136

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Figueroa, David G Mesa, AZ 63 807
Hale, Aaron Dean Chandler, AZ 1 83
Kohmura, Toshimi Ibaragi pref., JP 11 120
Vrtis, Joan K Phoenix, AZ 10 109
Walk, Michael Mesa, AZ 19 228

Cited Art

Patent Info (Count) # Cites Year
 
INTEL CORPORATION (1)
6,075,285 Semiconductor package substrate with power die 22 1997
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
4,349,862 Capacitive chip carrier and multilayer ceramic capacitors 104 1980
 
MURATA MANUFACTURING CO., LTD. (1)
6,153,290 Multi-layer ceramic substrate and method for producing the same 57 1998
 
NEC CORPORATION (1)
4,574,255 MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate 28 1983
 
OL SECURITY LIMITED LIABILITY COMPANY (1)
5,708,570 Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures 33 1995
 
TWECO PRODUCTS, INC. (1)
5,874,770 Flexible interconnect film including resistor and capacitor layers 220 1996

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
INTEL CORPORATION (21)
6,970,362 Electronic assemblies and systems comprising interposer with embedded capacitors 40 2000
6,840,777 Solderless electronics packaging 5 2000
6,710,255 Printed circuit board having buried intersignal capacitance and method of making 5 2001
6,636,416 Electronic assembly with laterally connected capacitors and manufacturing method 5 2001
6,800,947 Flexible tape electronics packaging 9 2001
7,099,139 Integrated circuit package substrate having a thin film capacitor structure 2 2004
7,120,031 Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors 10 2004
7,159,313 Solderless electronics packaging and methods of manufacture 7 2004
7,629,269 High-k thin film grain size control 2 2005
7,339,798 Electronic assemblies and systems comprising interposer with embedded capacitors 3 2005
7,692,284 Package using array capacitor core 0 2005
7,525,140 Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength 1 2005
7,670,919 Integrated capacitors in package-level structures, processes of making same, and systems containing same 0 2005
7,504,271 Integrated circuit package substrate having a thin film capacitor structure 0 2006
7,535,728 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors 0 2006
7,687,366 Pre-patterned thin film capacitor and method for embedding same in a package substrate 1 2006
7,709,934 Package level noise isolation 0 2006
7,733,626 Passive device structure 0 2007
7,755,165 iTFC with optimized C(T) 0 2008
7,656,644 iTFC with optimized C(T) 0 2008
7,989,916 Integrated capacitors in package-level structures, processes of making same, and systems containing same 0 2009
 
TERADATA US, INC. (5)
6,844,505 Reducing noise effects in circuit boards 4 2002
7,626,828 Providing a resistive element between reference plane layers in a circuit board 2 2003
7,271,348 Providing decoupling capacitors in a circuit board 2 2003
7,216,422 Method of forming a capacitor assembly in a circuit board 1 2004
7,791,896 Providing an embedded capacitor in a circuit board 2 2007
 
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (4)
7,359,213 Circuit board 1 2004
7,548,432 Embedded capacitor structure 1 2005
7,705,691 Capacitor interconnection 0 2005
7,748,115 Method of forming a circuit board 0 2007
 
FREESCALE SEMICONDUCTOR, INC. (4)
7,807,511 Method of packaging a device having a multi-contact elastomer connector contact area and device thereof 1 2006
7,696,016 Method of packaging a device having a tangible element and device thereof 1 2006
7,476,563 Method of packaging a device using a dielectric layer 17 2006
7,655,502 Method of packaging a semiconductor device and a prefabricated connector 7 2009
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
6,791,133 Interposer capacitor built on silicon wafer and joined to a ceramic substrate 13 2002
6,892,451 Method of making an interposer sub-assembly in a printed wiring board 4 2003
6,943,108 Interposer capacitor built on silicon wafer and joined to a ceramic substrate 2 2004
6,974,915 Printed wiring board interposer sub-assembly and method 6 2004
 
SAMSUNG ELECTRO-MECHANICS CO., LTD. (4)
7,351,915 Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same 7 2004
7,230,815 Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor 6 2005
7,663,892 Printed circuit board having embedded RF module power stage circuit 1 2006
8,279,616 Printed circuit board with embedded chip capacitor 0 2011
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (4)
6,998,308 Substrate for carrying a semiconductor chip and a manufacturing method thereof 8 2003
7,161,242 Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element 0 2004
7,707,713 Component-embedded circuit board fabrication method 1 2007
8,179,689 Printed circuit board, method of fabricating printed circuit board, and semiconductor device 0 2009
 
COMMISSARIAT A L'ENERGIE ATOMIQUE (3)
8,048,766 Integrated circuit on high performance chip 0 2004
8,142,593 Method of transferring a thin film onto a support 1 2006
8,389,379 Method for making a stressed structure designed to be dissociated 0 2009
 
GEORGIA TECH RESEARCH CORPORATION (3)
7,504,706 Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof 1 2006
7,456,459 Design of low inductance embedded capacitor layer connections 1 2006
7,705,423 Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit 4 2006
 
APPLE INC. (2)
7,446,389 Semiconductor die package with internal bypass capacitors 2 2005
7,583,511 Semiconductor die package with internal bypass capacitors 1 2008
 
AVX CORPORATION (2)
7,006,359 Modular electronic assembly and method of making 10 2004
7,280,343 Low profile electrolytic capacitor assembly 0 2006
 
CDA PROCESSING LIMITED LIABILITY COMPANY (2)
7,778,038 Power core devices and methods of making thereof 1 2005
7,613,007 Power core devices 17 2005
 
MOTOROLA SOLUTIONS, INC. (2)
7,056,800 Printed circuit embedded capacitors 4 2003
7,138,068 Printed circuit patterned embedded capacitance layer 1 2005
 
PANASONIC CORPORATION (2)
7,968,800 Passive component incorporating interposer 0 2007
8,213,185 Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate 1 2009
 
RENESAS ELECTRONICS CORPORATION (2)
6,757,178 Electronic circuit equipment using multilayer circuit board 48 2002
7,812,446 Semiconductor device 0 2008
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6,847,527 Interconnect module with reduced power distribution impedance 33 2002
 
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (1)
8,252,663 Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer 0 2010
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
7,621,041 Methods for forming multilayer structures 5 2006
 
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (1)
8,044,757 Electronic device including LTCC inductor 1 2009
 
EPCOS AG (1)
7,795,728 Electronic component 3 2003
 
FUJITSU LIMITED (1)
8,203,198 Thin film capacitor device used for a decoupling capacitor and having a resistor inside 1 2006
 
HITACHI, LTD. (1)
7,586,755 Electronic circuit component 0 2007
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
7,742,276 Wiring structure of laminated capacitors 3 2007
 
INTERNATIONAL RECTIFIER CORPORATION (1)
7,274,100 Battery protection circuit with integrated passive components 1 2004
 
KEMET ELECTRONICS CORPORATION (1)
8,125,766 Concentrated capacitor assembly 0 2008
 
LSI LOGIC CORPORATION (1)
6,618,938 Interposer for semiconductor package assembly 12 2001
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
7,385,286 Semiconductor module 7 2002
 
NOKIA MOBILE PHONES LTD. (1)
6,608,259 Ground plane for a semiconductor chip 15 2000
 
REALTEK SEMICONDUCTOR CORP. (1)
7,327,555 Capacitor structure 2 2006
 
RESEARCH IN MOTION RF, INC. (1)
7,224,040 Multi-level thin film capacitor on a ceramic substrate 13 2004
 
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES (1)
8,309,431 Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation 0 2004
 
SAE MAGNETICS (H.K.) LTD. (1)
8,085,522 Capacitor and method of manufacturing the same and capacitor unit 0 2007
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,129,571 Semiconductor chip package having decoupling capacitor and manufacturing method thereof 29 2004
 
THIN FILM TECHNOLOGY CORP. (1)
6,819,569 Impedance equalization module 0 2002

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