Coplanar mounting of printhead dies for wide-array inkjet printhead assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 25, 2002
Grant Date -
N/A
app pub date -
Feb 14, 2001
filing date -
Feb 14, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully