Multi-mode compliant connector and replaceable chip module utilizing the same
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United States of America Patent
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Jun 25, 2002
Issued Date -
N/A
app pub date -
Oct 26, 1999
filing date -
May 6, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A solderless electrical connector in which the contact members provide at least two modes of compliance. The first mode of compliance is determined primarily by the resilience of the encapsulating material. The contact members rotates and/or translates within the encapsulating material during the first mode of compliance, although elastic deformation of the contact members may also be factors. The encapsulating material provides a relatively large range of motion at a low force, allowing for the contact to achieve continuity and planarity despite a significant mismatch. Once the encapsulating material between the contact members and a surface of the housing is substantially compressed, further movement is constrained to promote elastic bending of the contact members in the second mode of compliance. A replaceable chip module using the present solderless connector is also disclosed.
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