Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
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United States of America Patent
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Jun 25, 2002
Issued Date -
N/A
app pub date -
Dec 19, 2000
filing date -
Apr 7, 1998
priority date (Note) -
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Abstract
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections in a semiconductor package is disclosed. A semiconductor device has active devices on the front surface, a first through-chip conductor having first electrical/physical characteristics passing from the front surface of the device to the back surface, a second through-chip conductor having second electrical/physical characteristics passing to the back surface, and an off-chip or chip-to-chip connector electrically connecting the active devices on the front surface to a different level of packaging.
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