Semiconductor device
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United States of America Patent
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Jun 25, 2002
Grant Date -
May 2, 2002
app pub date -
Aug 10, 1999
filing date -
May 28, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.
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