Vented semiconductor device package having separate substrate, strengthening ring and cap structures
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United States of America Patent
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Jun 25, 2002
Grant Date -
Aug 16, 2001
app pub date -
Oct 22, 1998
filing date -
Oct 24, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The device includes a strengthening ring arranged around a semiconductor chip that includes a process type electrode and that is mounted on an isolated substrate; a resin to fill spaces between the semiconductor chip and the isolated substrate; and a cap on the semiconductor chip and the strengthening ring, wherein at least one vent is formed perpendicular to the direction of the thickness of the semiconductor chip.
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