Power inverter with heat dissipating assembly
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United States of America Patent
Stats
-
Jun 25, 2002
Grant Date -
N/A
app pub date -
Mar 8, 2001
filing date -
Mar 8, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention is a power inverter having a heat dissipating assembly. A heat sink plate is supported on the printed circuit board in a spaced configuration so that a space exists between the heat sink plate and the outer housing. The printed circuit board assembly includes mosfets inserted into the printed circuit board and electrically connected thereto. The heat sink plate abuts against a first side of the mosfets at an upper end of the mosfets to directly absorb heat from the mosfets. The exterior surface of the housing is provided with a plurality of heat dissipating fins to further enable heat dissipation.
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