Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 2, 2002
Grant Date -
N/A
app pub date -
Jan 5, 1999
filing date -
May 19, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip 1 and a coil 2 are embedded in a flexible substrate 3 comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. 1 A first nonwoven fabric 12 having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force 11. 2 An IC chip and a coil are placed on the first nonwoven fabric after positioning them. 3 A second nonwoven fabric 13 is superposed on the IC chip and coil. 4 A top force 14 is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.
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