Dual dicing saw blade assembly and process for separating devices arrayed a substrate
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United States of America Patent
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Jul 2, 2002
Grant Date -
N/A
app pub date -
May 19, 2000
filing date -
May 27, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A dicing saw blade assembly with parallel blades separated by a spacer and attached to a single spindle on an automated dicing saw, is applicable to precisely separating CSP or MCM devices which have been fabricated on a polymeric substrate. Two parallel cuts are made simultaneously in the scribe streets of the substrate to separate the flip chip devices. The substrates are diced from the bottom side, thereby allowing use of thin blades for separating devices having relatively thick chips, as well as chips with attached heat spreaders.
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