Selective treatment of the surface of a microelectronic workpiece
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United States of America Patent
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Jul 2, 2002
Issued Date -
N/A
app pub date -
Nov 10, 1999
filing date -
Jan 27, 1999
priority date (Note) -
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Abstract
In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
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