Controlled cleavage process and device for patterned films
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United States of America
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Jul 2, 2002
Issued Date -
N/A
app pub date -
May 21, 1999
filing date -
May 21, 1999
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) in a selected manner through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth and the particles for a pattern at the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
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