Non-corrosive cleaning composition for removing plasma etching residues
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United States of America Patent
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Jul 2, 2002
Grant Date -
May 24, 2001
app pub date -
Nov 15, 1999
filing date -
Nov 15, 1999
priority date (Note) -
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Abstract
A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary ammonium hydroxides; (d) at least one organic carboxylic acid; and (e) optionally, a polyhydric compound. The pH of the composition is preferably between about 2 to about 6.
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