Compliant attachment interface
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 2, 2002
Grant Date -
N/A
app pub date -
Oct 4, 2000
filing date -
Oct 4, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Parallel surfaces are interfacially mechanically bonded and optionally electrically, and/or thermally connected using an interposer fabricated from a flexible laminates, such as flex PWB. The bond/connection points for the device made on one side of the interposer are displaced in the X and Y axis from the bond/connection points on the other or obverse side for the interposer and the board. The optional electrical/thermal connection through the interposer is made through one or more traces and vias in the flex board.
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