HERMETIC MULTI-LAYERED CIRCUIT ASSEMBLIES AND METHOD OF MANUFACTURE
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United States of America Patent
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-
Jul 2, 2002
Grant Date -
Jul 4, 2002
app pub date -
Dec 30, 2000
filing date -
Dec 30, 2000
priority date (Note) -
Granted
status (Latency Note)
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Abstract
Thin film, multi-layered components wherein the layers are hermetically sealed with a re-flowed conductive sealant (e.g. Pb/Sn solder). The sealant is applied to an endless ground conductor at the peripheral edge of at least one of each pair of opposed substrate layers prior to registering the conductors and re-flowing the sealant. The microstrip conductors comprise thin film adhesion and seed layers and a covering metalization. The signal and ground conductors are terminated with solder balls and the signal and ground conductors are connected with micro vias that extend through the substrates.
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