Interposer for separating stacked semiconductor chips mounted on a multi-layer printed circuit board
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United States of America Patent
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-
Jul 2, 2002
Grant Date -
N/A
app pub date -
Feb 1, 2000
filing date -
Mar 15, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes a first semiconductor chip, a second semiconductor chip, a multilayer printed circuit board having a first surface whereon the first semiconductor chip is mounted and a second surface whereon external connection terminals are provided, an interposer, and a sealing resin for sealing the first and second semiconductor chips. The interposer holds the second semiconductor chip above the first semiconductor chip such that there is a separation between them while electrically connecting the second semiconductor chip and the multilayer printed circuit board. The sealing resin is formed so as to fill the separation between the first and second semiconductor chips.
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