Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
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United States of America Patent
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Jul 2, 2002
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N/A
app pub date -
Mar 20, 2000
filing date -
Mar 20, 2000
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Abstract
A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
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