Connecting method of resin material molded product, process cartridge and assembling method of process cartridge
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United States of America Patent
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Jul 2, 2002
Grant Date -
N/A
app pub date -
May 22, 2000
filing date -
May 20, 1999
priority date (Note) -
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Abstract
A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.
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