Micromachine package fabrication method
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United States of America Patent
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-
Jul 9, 2002
Grant Date -
N/A
app pub date -
Nov 15, 1999
filing date -
Nov 15, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Micromachine chips are tested for validity while the micromachine chips are still in wafer form. Any defective micromachine chips are marked or otherwise identified. Coupons are attached to the micromachine chips. The coupons are attached only to the micromachine chips which have been tested and found to be good. In this manner, waste of coupons is avoided and labor associated with attaching the coupons to defective micromachine chips is saved.
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Family
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Cited Art Landscape
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