Circuit substrate
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United States of America Patent
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-
Jul 9, 2002
Grant Date -
N/A
app pub date -
Oct 30, 2000
filing date -
Oct 29, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit substrate in which the conductor portions constituting the functional devices formed in the insulating board have interfacial electric conductivities .sigma. of not larger than 2.90.times.10.sup.7 .OMEGA..sup.-1.multidot.m.sup.-1 to greatly lower the insertion losses.
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