Method for fabrication of high inductance inductors and related structure
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United States of America Patent
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Jul 9, 2002
Grant Date -
N/A
app pub date -
Aug 25, 2000
filing date -
Aug 25, 2000
priority date (Note) -
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Abstract
According to various embodiments, a conductor is patterned in a dielectric. The conductor can be patterned, for example, in the shape of a square spiral. The conductor can comprise, for example, copper, aluminum, or copper-aluminum alloy. The dielectric can be, for example, silicon oxide or a low-k dielectric. Trenches are etched next to the patterned conductor in the dielectric. The trenches are filled with a material having a permeability substantially higher than the permeability of the dielectric. The high permeability material can be, for example, nickel, iron, nickel-iron alloy, or magnetic oxide. As a result, an inductor having a high inductance value is achieved without lowering the quality factor of the inductor.
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