Methods of using atomic layer deposition to deposit a high dielectric constant material on a substrate

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United States of America Patent

PATENT NO 6420279
SERIAL NO

09894941

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Abstract

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Methods of forming hafnium oxide, zirconium oxide and nanolaminates of hafnium oxide and zirconium oxide are provided. These methods utilize atomic layer deposition techniques incorporating nitrate-based precursors, such as hafnium nitrate and zirconium nitrate. The use of these nitrate based precursors is well suited to forming high dielectric constant materials on hydrogen passivated silicon surfaces.

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Patent Owner(s)

  • III HOLDINGS 10, LLC;SHARP KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ono, Yoshi Camas, WA 95 5708
Solanki, Rajendra Portland, OR 15 2289
Zhuang, Wei-Wei Vancouver, WA 95 2822

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